improved performance
Experience the next level of cooling with the X-10 thermal compound, featuring an advanced formula in comparison with the X-8. With an improved silicone oil-based carrier material formula with a higher concentration of aluminum and zinc oxide powder, X-10 offers excellent thermal conductivity, low resistance and significantly higher viscosity. This makes it ideal for processors with high heat output, ensuring durability and resistance to the pump-out effect.
Long-term Stability Without Pump-Out Effect
The pump-out effect happens when thermal paste is squeezed out between the heat spreader and CPU cooler due to deformation from temperature changes. Materials like silicon and copper expand differently when heated, making this effect stronger, especially with copper coolers on GPUs. This effect is less noticeable at lower temperatures but becomes more pronounced at higher ones. X-10’s higher viscosity is essential for processors with higher heat output. Reapplication of thermal paste may be needed if CPU temperatures rise and clock speeds decrease.
Optimized for Air, Water Cooling and beyond
The X-10 thermal compound combines excellent performance with user-friendly application, making it perfect for both beginners and expeirnced PC users. Designed for optimal heat transfer in both CPU and GPU cooling, X-10 excels in air and water-cooled systems and even in demanding professional conditions. Whether you’re maintaining your everyday PC or fine-tuning a high-end custom PC build, X-10 guarantees lower temperatures and consistent, reliable cooling.
Packaging Sizes to Fit Any Project
Polartherm pastes come in several capacities ranging from 2g to 40g, making it ideal for individual upgrades or system integrators. When used on an Intel Core Ultra or AMD Rzyen CPU the capacity is sufficient for the following number of applications:
- 2g = 3-4 applications
- 5g = 8-10 applications
- 10g = 18-20 applications
- 40g = 70-80 applications
Every Polartherm thermal compound comes equipped with applicators and spatulas, providing you with three convenient application methods:
- Direct Application: Apply the paste directly to the CPU without a spatula or applicator. Once the cooler is mounted, the pressure will evenly distribute the paste, filling in microscopic gaps.
- Spatula Method: Use the included spatula to spread the compound across the CPU surface. The cooler will compress the paste, ensuring full coverage even in the smallest areas.
- Applicator Method: Squeeze the paste directly onto the CPU heat spreader using the provided applicator, ensuring a thin, even layer. The cooler pressure will then fill any remaining gaps.
Technical Specification
Density:
Color:
Silicone based:
Electrically conductive:
2.6g/cm3
Grey
Yes
