EGP225.00
Baraf is a high-performance thermal paste that enhances the efficiency of heat conduction. Easy to apply and perfectly fills the space between your cooler and CPU. Nanotechnology in the paste improves heat conduction via its micro molecules. Made with non-electric conductive materials, the Baraf is completely safe to use. Comes with a spreader for quick and easy application.
• High viscocity allows for easy application
• Nanotechnology improves heat conduction
• Non-electric conductive materials ensure safe usage
• Low evaporation point and high temperature tolerance
• Spreader allows for quick and easy application
• Comes with 3.5g thermal paste
Specifications are subject to change without notice.
Products and models may vary depending on your region.
Contact your local retailer for more information.
Out of stock
| Model | Baraf-S 3.5g |
| Thermal Conductivity | >5.15 W/m-K |
| Thermal Impedance | < 0.004 ℃-in2/W |
| Specific Gravity | >3.25 |
| Viscosity | 12500 |
| Moment Beared Temperature | -50~340℃ |
| Thixotropic Index | 280/0.1mm |
| Operation Temperature | -30℃ – 280℃ |
| Silicone Compounds | 10% |
| Carbon Compounds | 45% |
| Metal Oxide Compounds | 45% |
| Net Weight | 3.5g |
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