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GRIZZLY CPU Contact Frame LGA1700
425,00 EGPCPU Contact Frame
The Thermal Grizzly CPU Contact Frame Intel 1700 LT is a mounting aid for Intel mainboards with the LGA1700 socket. The contact frame replaces the standard ILM of the mainboard and improves the cooling performance of the CPU cooler through optimized contact pressure. The "Lite" version of the frame is manufactured using injection molding.
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GRIZZLY HYDRONAUT 1G
300,00 EGPWith its excellent thermal conductivity, Hydronaut can also be used in the overclocking sector, but it was specially developed for users with large heat sinks, such as water cooling systems.
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GRIZZLY HYDRONAUT 7.8G
950,00 EGPWith its excellent thermal conductivity, Hydronaut can also be used in the overclocking sector, but it was specially developed for users with large heat sinks, such as water cooling systems.
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GRIZZLY KRYONAUT 1G
375,00 EGPKryonaut thermal paste was developed specifically for extremely demanding applications and the highest demands of the overlocking community. It is also recommended as a top product for critical cooling systems in the industrial sector.
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GRIZZLY KRYONAUT EXTREME 2G
775,00 EGPKryonaut extreme is a high performance paste. Maximum thermal conductivity through the smallest particle size and layer thickness, combined with improved low-temperature resilience are the basis for the best temperatures in extreme overclocking.
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GRIZZLY Thermal Pads MINUS 120X20X0.5MM
575,00 EGPMinus Pad 8
The high-performance heat-conducting pads of the minus pad 8 series have a very elastic and adaptable surface with very high thermal conductivity. Even the smallest component differences can thus be compensated very we
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GRIZZLY Thermal Pads PHASE PTM 50X40
550,00 EGPPhaseSheet PTM
The PhaseSheet PTM is a thermal pad based on a phase change material (PCM). The pads, which are solid at room temperature, can be easily applied and liquefy during operation, allowing them to effectively dissipate heat like a thermal paste. PhaseSheet PTM is electrically non-conductive and can therefore be used in many areas, with the primary application being in processors and graphics chips.