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GIGABYTE Radeon™ RX 9070 XT GAMING OC 16G
40.000,00 EGPFEATURES
- Powered by Radeon™ RX 9070 XT
- Integrated with 16GB GDDR6 256bit memory interface
- WINDFORCE cooling system
- Hawk fan
- Server-grade Thermal conductive gel
- RGB Lighting
- Dual BIOS (Performance / Silent)
- Reinforced structure
CORE CLOCK
Boost Clock* : up to 3060 MHz (Reference card: 2970 MHz) Game Clock* : up to 2520 MHz (Reference card: 2400 MHz)
Out of stock
GIGABYTE UD850GM
6.000,00 EGPKEY FEATURE
- Ultra Durable
- Main Japanese capacitors
- Enhanced thermal solution
- 120mm smart hydraulic bearing (HYB) fan
- OVP/OPP/SCP/UVP/OCP/OTP protection
- 80 PLUS Gold certified
- Fully modular design
- Powerful single +12V rail
- Compact design
- 5 years warranty (Adjusted according to different regions)
Out of stock
GIGABYTE X870 GAMING WIFI6
10.900,00 EGP- AMD Socket AM5：Supports AMD Ryzen™ 9000 / 8000 / 7000 Series Processors
- Digital twin 8+2+2 phases VRM solution
- Dual Channel DDR5：4*DIMMs with AMD EXPO™Memory Module Support
- WIFI EZ-Plug: Quick and easy design for Wi-Fi antenna installation
- EZ-Latch Plus：PCIe and M.2 slots with Quick Release & Screwless Design
- EZ-Latch Click：M.2 heatsinks with screwless design
- Friendly UI: Multi-Theme, AIO Fan Control, and Q-Flash Auto Scan in BIOS and SW.
- Ultra-Fast Storage：3*M.2 slots, including 1* PCIe 5.0 x4
- Efficient Thermal：VRM Thermal Armor Advanced & M.2 Thermal Guard
- Fast Networking：2.5GbE LAN & Wi-Fi 6 802.11ax
- Extended Connectivity：Dual USB4 Type-C with DP-Alt, HDMI
Out of stock
GIGABYTE Z890 AORUS ELITE X ICE
16.500,00 EGPKey Features
- Supports Intel® Core™ Ultra processors (Series 2)
- Digital twin 16+1+2 phases VRM solution
- D5 Bionic Corsa for Infinite Memory Performance
- AORUS AI SNATCH：Auto-Overclocking Software by AI models
- AI Perfdrive：Provides optimal and customized BIOS preset profile for users
- Premium Compatibility：4*DDR5 with XMP Memory Module Support
- WIFI EZ-Plug：Quick and easy design for Wi-Fi antenna installation
- EZ-Latch Plus：PCIe and M.2 slots with Quick Release & Screwless Design
- EZ-Latch Click：M.2 heatsinks with screwless design
- Sensor Panel Link：Onboard video port for hassle-free in-chassis panel setup
- Friendly UI： Multi-Theme, AIO Fan Control, and Q-Flash Auto Scan in BIOS and SW
- New Power Monitor in HWinfo for real-time monitoring on CPU power phases
- Ultra-Fast Storage：5*M.2 slots, including 1* PCIe 5.0 x4
- Efficient Thermal：VRM Thermal Armor Advanced & M.2 Thermal Guard L
- Fast Networking：2.5GbE LAN & Wi-Fi 7 with directional Ultra-high gain antenna
- Extended Connectivity：THUNDERBOLT™ 4 Type-C with DP-Alt
- High-Res Audio：ALC1220 & WIMA Audiophile Grade Capacitors
- Ultra Durable PCIe Armor：The metal back plate of PCIe x16 slot for enhanced durability
- PCIe UD Slot X：PCIe 5.0 x16 slot with 10X strength for graphics card
Out of stock
GIGABYTE Z890M GAMING X
9.750,00 EGPKey Features
- Supports Intel® Core™ Ultra processors (Series 2)
- Digital 8+1+2 phases VRM solution
- D5 Bionic Corsa : for Infinite Memory Performance
- AI Perfdrive : Provides optimal and customized BIOS preset profile for users
- Premium Compatibility : 4*DDR5 with XMP Memory Module Support
- PCIe EZ-Latch : PCIe slots with Quick Release & Screwless Design
- Friendly UI : Multi-Theme, AIO Fan Control, and Q-Flash Auto Scan in BIOS and SW
- New Power Monitor in HWinfo for real-time monitoring on CPU power phases
- Ultra-Fast Storage : 3*M.2 slots, including 1* PCIe 5.0 x4
- Efficient Thermal : VRM Thermal Armor Advanced & M.2 Thermal Guard
- Fast Networking : 2.5GbE LAN
- Extended Connectivity : HDMI, DisplayPort
Out of stock
GRIZZLY CPU Contact Frame LGA1700
425,00 EGPCPU Contact Frame
The Thermal Grizzly CPU Contact Frame Intel 1700 LT is a mounting aid for Intel mainboards with the LGA1700 socket. The contact frame replaces the standard ILM of the mainboard and improves the cooling performance of the CPU cooler through optimized contact pressure. The "Lite" version of the frame is manufactured using injection molding.
Out of stock
GRIZZLY HYDRONAUT 1G
300,00 EGPWith its excellent thermal conductivity, Hydronaut can also be used in the overclocking sector, but it was specially developed for users with large heat sinks, such as water cooling systems.
Out of stock
GRIZZLY HYDRONAUT 3.9G
600,00 EGPWith its excellent thermal conductivity, Hydronaut can also be used in the overclocking sector, but it was specially developed for users with large heat sinks, such as water cooling systems.
Out of stock
GRIZZLY HYDRONAUT 7.8G
950,00 EGPWith its excellent thermal conductivity, Hydronaut can also be used in the overclocking sector, but it was specially developed for users with large heat sinks, such as water cooling systems.
Out of stock
GRIZZLY Thermal Pads MINUS 120X20X0.5MM
575,00 EGPMinus Pad 8
The high-performance heat-conducting pads of the minus pad 8 series have a very elastic and adaptable surface with very high thermal conductivity. Even the smallest component differences can thus be compensated very we
Out of stock
GRIZZLY Thermal Pads PHASE PTM 50X40
550,00 EGPPhaseSheet PTM
The PhaseSheet PTM is a thermal pad based on a phase change material (PCM). The pads, which are solid at room temperature, can be easily applied and liquefy during operation, allowing them to effectively dissipate heat like a thermal paste. PhaseSheet PTM is electrically non-conductive and can therefore be used in many areas, with the primary application being in processors and graphics chips.
Out of stock
